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Home > Your application > Electronics
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Electronics |
Challenges for materials for electronics industry
Heat dissipation within substrates, thermal interface performance, impurity content in wafers, curing behavior of resins are just some of the questions that electronics and semiconductor designers need to answer...
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Substrates must be good electrical insulators but also good thermal conductors to allow the dissipation of heat, and hence ensure fast chip response times. Knowing the thermal conductivity of a substrate is therefore crucial.
Chips are encapsulated in protective resin. Differential thermal expansion of the resin with respect to the Gold wire connection can damage the chips.
Photoresist inks used for photolithography are constantly evolving(193nm down to 45nm in the next few years). Knowledge of photoresist curing behavior with respect to temperature is necessary in order to master the photolithographic process.
Soldering paste melting and crystallization temperatures are important parameters in the manufacturing process for the soldering of components on PCBs.
Liquid Crystal materials used in LCD displays have properties that change with temperature. This temperature is called the glass transition temperature.
Thermal interface stability (grease, gel, conducting polymers, pads): the properties of these substances change with the environmental conditions (temperature, moisture content, etc.).
Heat sinks made of composite materials are anisotropic. Knowing the thermal expansion and thermal conductivity of these materials in all directions is essential in electronics design work.
Impurities in wafers can significantly affect the functioning of the wafer, as can charges trapped in the semiconductor lattice. | X |
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Thermal analysis and calorimetric solutions for electronics materials |
SETARAM can provide a global thermal analysis solution for electronics materials research through its wide range of dedicated instruments...
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Advanced ceramic (AIN, BeO…) or hybrid semiconductor (Ge) substrates will replace Si owing to their good thermal conductivity.
- direct thermal conductivity measurement up to 200°C, use TCi thermal conductivity from Mathis Instruments, distributed worldwide by Setaram.
- The sintering process of advanced ceramic substrates is evaluated by Thermomechanical Analysis (TMA) using the SETSYS 16 TMA up to 1600°C. Thermal expansion and anisotropy of various bulk materials as well as characterizing the encapsulant's thermal expansion down to 1￭m can also be measured using this instruments
- The fusion and crystallization temperatures of lead-free soldering pastes are measured with a Differential Scanning Calorimeter (DSC131 or micro DSCIII). These instruments are well suited to the measurement of curing times and temperatures of resins and photoresists, or Liquid Crystal glass transition (Tg).
- The thermal stability of thermal interfaces (gel, paste, pads, etc.) is characterized by thermogravimetry (TGA) using a SETSYS TGA 16, which measures the change of sample mass with temperature down to 0.3￭g.
- The WETSYS humidity generator can be coupled to the SETSYS TGA 16 for studies of the stability of materials under conditions of relative humidity. Coupling the Setsys 16 TGA to a mass spectrometer or FTIR (Evolved Gaz Analysis) will provide information of traces of impurities in a wafer, for example.
- Charges that get "trapped" in the lattice of a semiconductor during its fabrication can be revealed by Thermostimulated Current analysis (TSC). The TSC spectrum is the space charge signature of a material, and is also a suitable tool for characterizing piezoelectric materials. | X |
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High-performance modular thermal analyzers (ambient / 2400°C) |
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Widest temperature range (-150 / 2400°C) on the market
Modularity: the different modules DTA, DSC, TGA, TMA can be adapted interchangeably around the same structure
Measurement performance: satisfy unique resolution, precision and sensitivity criteria
SETSYS Evolution is today the state-of-the-art in research-grade thermal analyzers.
It includes:
-SETSYS Evolution DTA (up to 2400°C), DSC (up to 1600°C)
-SETSYS Evolution TGA
-SETSYS Evolution simultaneous TGA-DTA/DSC-EGA
-SETSYS Evolution TMA
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TGA, DTA, DSC and Simultaneous TGA-DTA, TGA-DSC from ambient to 1600°C |
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LABSYS evo- Coupling to gas analysis (FTIR, MS)
- New 3D high-precision Cp sensor
- Cp measurement within 2 % up to 1600 °C
- Calisto software
LABSYS evo offers TGA with simultaneous DTA or DSC and Cp measurement within the temperature range of ambient to 1 600 °C. The LABSYS evo features a NEW high performance top loading balance and a unique 3D high-precision (Calvet type) Cp rod. Thanks to its unique ergonomic design and market leading Calisto software the LABSYS evo offers you the most easy-to-use Thermal Analysis system with uncompromised performance.
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An innovative line of Thermal Analyzers (-120 / 830°C) with 3D-Inside technology: DSC, High Pressure DSC, Robot DSC, TG-DSC-EGA |
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The SENSYS evo offers the most precise DSC sensor together with a truly symmetrical microbalance to give YOU a combined TG-DSC system with totally unmatched performance. Additionally both measurement sensors are totally independent,so can be operated independently or simultaneously without compromising performance.
SENSYS evo can be used in various configurations:
- DSC in horizontal or vertical mode
- High Pressure DSC(up to 500 bars at 600°C)
- Robotic DSC, with 48 samples, even under pressure
- Simultaneous TG-DSC-coupling to gas analysis (BET, gas sorption, FTIR, MS)
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Large volume thermal analyzers (ambient / 2100°C) : Calorimeter, DTA/DSC, TGA-DTA/DSC, TMA |
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96 LINE, a modular line of high-temperature (ambient - 2100°C) and large-volume thermal analyzers
Large sample volume: for analysing bulky, massive and non-dissociable samples (e.g. corrosion studies of mechanical parts, etc), for working on mixed materials (concrete core sample), for detecting very weak variations of mass in TGA (corrosion studies on sheet steel, etc.)
Modularity: the different calorimeter modules (DTA, DSC, TGA, TMA) can be adapted interchangeably around the same structure
96 Line includes:
- MHTC 96 for calorimetric (drop) and DSC measurements
- DTA, DSC 96
- TGA 96 for thermogravimetric and simultaneous TGA and DSC/DTA measurements
- TMA 96
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Thermally Stimulated Currents, the solution to accessing the finest structural information |
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TSCIIThis thermal analysis method uses MOLECULAR MOBILITY to access structural information that cannot be obtained by any other technique. It also gives access to dynamic parameters (ΔH, ΔS and relaxation time ζ).
Properties measured by TSC include polymorphism, crystalline/amorphous rate, purity, glass transition, relaxation phenomena, etc.
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More Thermal Conductivity Testing in less time |
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TCiThe C-Therm Technologies TCi is truly a 'one size fits all' thermal conductivity tool. No other instrument can test solids, liquids, powders, and pastes. Within a material type, the technology has the attributes necessary as a lab tool to accelerate your research & development efforts or improve your quality control. As an added bonus, the technology can be migrated to the shop floor to gain insights into your production processes.
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An-easy-to-use Differential Scanning Calorimeter DSC (-170 to 700°C) with a 3-year warranty |
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DSC131 evoDSC131 evo: for testing, QC and academic thermal analysis
laboratories. An instrument designed from the ground up to
be robust, high performance and above all user friendly
featuring market leading intuitive CALISTO software and low operating costs.
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Controlled Humidity Generator |
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WetsysHumidity is known to have a significant influence on the stability of many materials. The controlled humidity generator WETSYS can:
- deliver a very precise level of relative humidity (RH) from 5 to 95% depending on the temperature
- be connected to other SETARAM instruments, and in particular to the SENSYS TG DSC as well as other analysis instrument (RX, GC, etc.) for studies of sorption, hydration, stability, etc.
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A fully automated Sieverts instrument for measuring gas sorption properties of materials |
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PCTPro-2000This quality instrument is specifically designed for high precision measurements over a wide range of sample sizes, pressures and temperatures
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PID controlled Cryostat for 4 to 373 K gas sorption measurements |
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CryoProThe CryoPro is coupled to the PCTPro-2000 for constant temperature measurements from liquid helium to 100°C and pressures from vacuum to 200 bar.
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Sample attachment for the PCTPro-2000 Sorption Gas Analyzer |
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MicroDoserThe MicroDoser Sample Attachment connects to the PCTPro-2000 to allow measurements on samples from only a few milligrams to gram sizes.
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Stand-alone High Pressure Mass Spectrometer for gas composition analysis from 200 bar to 10-8 mtorr |
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RGAProThe RGAPro is a residual gas analyzer designed to work with the PCTPro-2000 or any other gas process for real-time compositional analysis of a wide range of gases.
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Thermal Analysis Software |
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CALISTOCALISTO is a new software developed for Thermal Analysis applications from DSC, TGA and Calorimetry.
CALISTO comprises two independent parts:
- CALISTO ACQUISITION is dedicated for the control of SETARAM Thermal Analysis Systems
- CALISTO PROCESSING is designed for the treatment of any Thermal Analysis Data independent of instrument type and manufacturer.
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